Carrier for small pad for chemical mechanical polishing
US9873179B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2016 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Mar 9, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing system includes a substrate support configured to hold a substrate during a polishing operation, a polishing pad assembly include a membrane and a polishing pad portion, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad carrier includes a casing having a cavity and an aperture connecting the cavity to an exterior of the casing. The polishing pad assembly is positioned in the casing such that the membrane divides the cavity into a first chamber and a second chamber and the aperture extends from the second chamber. The polishing pad carrier and polishing pad assembly are positioned and configured such that at least during application of a sufficient pressure to the first chamber the polishing pad portion projects through the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.