Chantal Combi
18Patents
9h-index
22Co-inventors
68Inventor score
Filing activity: Oct 29, 2002 → Oct 31, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6869856B2 | Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling | Electricity | 40 | Expired |
| US8049287B2 | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device | Electricity | 36 | Active |
| US8044929B2 | Analog data-input device provided with a pressure sensor of a microelectromechanical type | Electricity | 32 | Active |
| US7322236B2 | Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device | Physics | 28 | Expired |
| US7875942B2 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Electricity | 24 | Active |
| US7928960B2 | Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device | Emerging Cross-Sectional Technologies | 24 | Active |
| US7678600B2 | Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate | Performing Operations; Transporting | 18 | Active |
| US7022542B2 | Manufacturing method of a microelectromechanical switch | Electricity | 15 | Expired |
| US8134214B2 | Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates | Electricity | 11 | Active |
| US8847340B2 | Packaged sensor structure having sensor opening and package opening aligned with sensor element | Electricity | 7 | Active |
| US7489004B2 | Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness | Electricity | 7 | Active |
| US7343805B2 | Surface acoustic wave pressure sensor | Physics | 4 | Active |
| USRE46671E1 | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device | General | 3 | Active |
| US8546895B2 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Electricity | 1 | Active |
| US7421904B2 | Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device | Physics | 1 | Active |
| US8043881B2 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Electricity | 1 | Active |
| US7242066B2 | Manufacturing method of a microelectromechanical switch | Electricity | 0 | Expired |
| US8796059B2 | Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.