Inventor · Clifton Park, NY, US

E. Todd Ryan

12Patents

5h-index

20Co-inventors

62Inventor score

Filing activity: Jul 31, 2003 → Feb 28, 2014

Most-cited inventions

Patent	Title	Area	Cited by	Status
US6919636B1	Interconnects with a dielectric sealant layer	Electricity	54	Expired
US7557035B1	Method of forming semiconductor devices by microwave curing of low-k dielectric films	Electricity	22	Active
US7737052B2	Advanced multilayer dielectric cap with improved mechanical and electrical properties	Electricity	20	Active
US8470706B2	Methods to mitigate plasma damage in organosilicate dielectrics	Electricity	7	Active
US8481423B2	Methods to mitigate plasma damage in organosilicate dielectrics	Electricity	6	Active
US9040411B2	Advanced low k cap film formation process for nano electronic devices	Electricity	4	Active
US8592312B2	Method for depositing a conductive capping layer on metal lines	Electricity	2	Active
US8212346B2	Method and apparatus for reducing semiconductor package tensile stress	Electricity	2	Active
US8212337B2	Advanced low k cap film formation process for nano electronic devices	Electricity	1	Active
US7998856B2	Interconnects with a dielectric sealant layer	Electricity	1	Active
US8324093B2	Methods for fabricating semiconductor devices including azeotropic drying processes	Electricity	0	Active
US8664109B2	Advanced low k cap film formation process for nano electronic devices	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.