Eddy Kunnen
8Patents
3h-index
12Co-inventors
50Inventor score
Filing activity: Dec 9, 2004 → Dec 20, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7338896B2 | Formation of deep via airgaps for three dimensional wafer to wafer interconnect | Electricity | 252 | Active |
| US7400024B2 | Formation of deep trench airgaps and related applications | Electricity | 40 | Expired |
| US7396732B2 | Formation of deep trench airgaps and related applications | Electricity | 21 | Expired |
| US7060587B2 | Method for forming macropores in a layer and products obtained thereof | Emerging Cross-Sectional Technologies | 3 | Expired |
| US10128124B2 | Method for blocking a trench portion | Electricity | 0 | Active |
| US9502264B2 | Method for selective oxide removal | Electricity | 0 | Active |
| US10768138B2 | Protecting a substrate region during fabrication of a FET sensor | Physics | 0 | Active |
| US7566919B2 | Method to reduce seedlayer topography in BICMOS process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.