John Desko
8Patents
4h-index
15Co-inventors
46Inventor score
Filing activity: Aug 30, 1999 → Nov 3, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6372600B1 | Etch stops and alignment marks for bonded wafers | Electricity | 25 | Expired |
| US6987052B2 | Method for making enhanced substrate contact for a semiconductor device | Electricity | 5 | Expired |
| US6790753B2 | Field plated schottky diode and method of fabrication therefor | Electricity | 4 | Expired |
| US7339274B2 | Metallization performance in electronic devices | Electricity | 4 | Expired |
| US7573097B2 | Lateral double diffused MOS transistors | Electricity | 2 | Active |
| US6828649B2 | Semiconductor device having an interconnect that electrically connects a conductive material and a doped layer, and a method of manufacture therefor | Electricity | 2 | Expired |
| US6690037B1 | Field plated Schottky diode | Electricity | 2 | Expired |
| US6737311B2 | Semiconductor device having a buried layer for reducing latchup and a method of manufacture therefor | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.