John L. Sturtevant
10Patents
4h-index
21Co-inventors
60Inventor score
Filing activity: Feb 28, 1994 → Aug 31, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5516608A | Method for controlling a line dimension arising in photolithographic processes | Physics | 101 | Expired |
| US6913872B1 | Dual-wavelength exposure for reduction of implant shadowing | Electricity | 9 | Expired |
| US7349752B1 | Dynamically coupled metrology and lithography | Electricity | 8 | Expired |
| US6797456B1 | Dual-layer deep ultraviolet photoresist process and structure | Physics | 5 | Expired |
| US11061373B1 | Method and system for calculating probability of success or failure for a lithographic process due to stochastic variations of the lithographic process | Physics | 4 | Active |
| US8607168B2 | Contour alignment for model calibration | Physics | 1 | Active |
| US6733936B1 | Method for generating a swing curve and photoresist feature formed using swing curve | Physics | 1 | Expired |
| US11270054B1 | Method and system for calculating printed area metric indicative of stochastic variations of the lithographic process | Physics | 0 | Active |
| US11699017B2 | Die yield assessment based on pattern-failure rate simulation | Physics | 0 | Active |
| US10445452B2 | Simulation-assisted wafer rework determination | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.