Jonathan B. Smith
9Patents
5h-index
14Co-inventors
52Inventor score
Filing activity: Apr 6, 1998 → Jun 15, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6261963A | Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6514844B1 | Sidewall treatment for low dielectric constant (low K) materials by ion implantation | Electricity | 13 | Expired |
| US6500755B2 | Resist trim process to define small openings in dielectric layers | Electricity | 11 | Expired |
| US5985364A | Method of exhaust control for spin-on films with reduced defects | Performing Operations; Transporting | 10 | Expired |
| US6294472A | Dual slurry particle sizes for reducing microscratching of wafers | Electricity | 6 | Expired |
| US6315637A | Photoresist removal using a polishing tool | Performing Operations; Transporting | 5 | Expired |
| US6406993B1 | Method of defining small openings in dielectric layers | Electricity | 4 | Expired |
| US7329582B1 | Methods for fabricating a semiconductor device, which include selectively depositing an electrically conductive material | Electricity | 3 | Active |
| US7737021B1 | Resist trim process to define small openings in dielectric layers | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.