Inventor · Stowe, VT, US

Keith E. Downes

13Patents
4h-index
17Co-inventors
53Inventor score

Filing activity: May 13, 2004 → Jan 28, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US8236663B2 Dual-damascene process to fabricate thick wire structure Electricity 14 Active
US7361950B2 Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric Electricity 12 Expired
US7602068B2 Dual-damascene process to fabricate thick wire structure Electricity 6 Active
US7915134B2 Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material Electricity 5 Active
US9171778B2 Dual-damascene process to fabricate thick wire structure Electricity 4 Active
US7728372B2 Method and structure for creation of a metal insulator metal capacitor Electricity 3 Active
US7910450B2 Method of fabricating a precision buried resistor Electricity 3 Active
US8753950B2 Dual-damascene process to fabricate thick wire structure Electricity 3 Active
US7235487B2 Metal seed layer deposition Electricity 2 Expired
US7879716B2 Metal seed layer deposition Electricity 1 Active
US8207568B2 Process for single and multiple level metal-insulator-metal integration with a single mask Electricity 1 Active
US8435864B2 Process for single and multiple level metal-insulator-metal integration with a single mask Electricity 0 Active
US8227849B2 Method and structure for creation of a metal insulator metal capacitor Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.