Meiyee Shek
9Patents
4h-index
27Co-inventors
49Inventor score
Filing activity: Apr 29, 2002 → Sep 30, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7879683B2 | Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay | Electricity | 28 | Active |
| US6656840B2 | Method for forming silicon containing layers on a substrate | Electricity | 23 | Expired |
| US7229911B2 | Adhesion improvement for low k dielectrics to conductive materials | Electricity | 8 | Expired |
| US7718548B2 | Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface | Electricity | 7 | Active |
| US7371427B2 | Reduction of hillocks prior to dielectric barrier deposition in Cu damascene | Electricity | 4 | Expired |
| US7601651B2 | Method to improve the step coverage and pattern loading for dielectric films | Electricity | 3 | Active |
| US8236684B2 | Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer | Electricity | 2 | Active |
| US7723228B2 | Reduction of hillocks prior to dielectric barrier deposition in Cu damascene | Electricity | 2 | Active |
| US7851385B2 | Low temperature conformal oxide formation and applications | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.