Oscar Ojeda
11Patents
0h-index
26Co-inventors
40Inventor score
Filing activity: Dec 11, 2015 → May 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11373951B2 | Via structures having tapered profiles for embedded interconnect bridge substrates | Electricity | 0 | Active |
| US11116084B2 | Method, device and system for providing etched metallization structures | Electricity | 0 | Active |
| US11528811B2 | Method, device and system for providing etched metallization structures | Electricity | 0 | Active |
| US11948848B2 | Subtractive etch resolution implementing a functional thin metal resist | Electricity | 0 | Active |
| US11652036B2 | Via-trace structures | Electricity | 0 | Active |
| US12191161B2 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Electricity | 0 | Active |
| US10438812B2 | Anisotropic etching systems and methods using a photochemically enhanced etchant | Electricity | 0 | Active |
| US10798817B2 | Method for making a flexible wearable circuit | Electricity | 0 | Active |
| US11817349B2 | Conductive route patterning for electronic substrates | Electricity | 0 | Active |
| US10515824B2 | Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field | Electricity | 0 | Active |
| US11721631B2 | Via structures having tapered profiles for embedded interconnect bridge substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.