Peter Huebler
6Patents
3h-index
12Co-inventors
46Inventor score
Filing activity: Mar 30, 2004 → Oct 29, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7416992B2 | Method of patterning a low-k dielectric using a hard mask | Emerging Cross-Sectional Technologies | 4 | Active |
| US7183629B2 | Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line | Electricity | 4 | Expired |
| US8039395B2 | Technique for forming embedded metal lines having increased resistance against stress-induced material transport | Electricity | 4 | Active |
| US8097542B2 | Etch stop layer of reduced thickness for patterning a dielectric material in a contact level of closely spaced transistors | Emerging Cross-Sectional Technologies | 1 | Active |
| US7063091B2 | Method for cleaning the surface of a substrate | Electricity | 0 | Expired |
| US8698312B2 | Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.