Inventor · Hubei, CN

Qinxiang Wei

7Patents

2h-index

16Co-inventors

40Inventor score

Filing activity: Jul 27, 2018 → Sep 28, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US10658378B2	Through array contact (TAC) for three-dimensional memory devices	Electricity	4	Active
US10825929B2	Structures and methods for reducing stress in three-dimensional memory device	Physics	2	Active
US10847539B2	Three-dimensional memory devices having through stair contacts and methods for forming the same	Electricity	2	Active
US11716846B2	Three-dimensional memory devices having through stair contacts and methods for forming the same	Electricity	1	Active
US10937806B2	Through array contact (TAC) for three-dimensional memory devices	Electricity	1	Active
US12035530B2	Three-dimensional memory devices having through stair contacts and methods for forming the same	Electricity	0	Active
US11450770B2	Structures and methods for reducing stress in three-dimensional memory device	Physics	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.