Renzo Maccagnan
8Patents
7h-index
12Co-inventors
52Inventor score
Filing activity: Nov 18, 1996 → Feb 8, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6363294B1 | Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision | Electricity | 402 | Expired |
| US5874345A | Method for planarizing TEOS SiO.sub.2 filled shallow isolation trenches | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6281068A | Method for buried plate formation in deep trench capacitors | Electricity | 15 | Expired |
| US6716764B1 | Method of forming first level of metallization in DRAM chips | Electricity | 14 | Expired |
| US6417072B2 | Method of forming STI oxide regions and alignment marks in a semiconductor structure with one masking step | Electricity | 11 | Expired |
| US5930585A | Collar etch method to improve polysilicon strap integrity in DRAM chips | Electricity | 11 | Expired |
| US6297089A | Method of forming buried straps in DRAMs | Electricity | 8 | Expired |
| US6258727A | Method of forming metal lands at the M0 level with a non selective chemistry | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.