Shunbin Li
12Patents
1h-index
23Co-inventors
50Inventor score
Filing activity: Dec 31, 2013 → Jul 13, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11705437B1 | Interconnection structure of system on wafer and PCB base on TSV process and method for manufacturing the same | Electricity | 1 | Active |
| US12149642B2 | Lightweight identity authentication method based on physical unclonable function | Electricity | 0 | Active |
| US12177072B1 | Data storage system and method, storage medium, and electronic device | Electricity | 0 | Active |
| US11052404B1 | Apparatus for remediation of a copper and nickel co-contaminated soil and a method for using the same | Performing Operations; Transporting | 0 | Active |
| US11983481B2 | Software-defined wafer-level switching system design method and apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US12095862B1 | Data processing system and method | Physics | 0 | Active |
| US11860893B1 | Input/output proxy method and apparatus for mimic Redis database | Electricity | 0 | Active |
| US12112115B2 | Routing structure and method of wafer substrate with standard integration zone for integration on-wafer | Electricity | 0 | Active |
| US9462619B2 | Method for establishing X2 interface IPSec tunnel, base station, system and computer storage medium | Electricity | 0 | Active |
| US11776879B1 | Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof | Electricity | 0 | Active |
| US11887964B1 | Wafer-level heterogeneous dies integration structure and method | Electricity | 0 | Active |
| US11876071B1 | System-on-wafer structure and fabrication method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.