Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
US6340608B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2000 |
| Grant date | Jan 22, 2002 |
| Priority date | — |
| Expiry date | Jul 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal track thereover are provided. A metal bump is formed over the exposed metal terminating pad. A photosensitive resin plug is formed over the metal bump. The metal bump of the semiconductor chip is aligned with the corresponding metal track on the separate substrate. The photosensitive resin plug over the metal bump is mated with the corresponding the metal track. The photosensitive resin plug is exposed to UV light to cure the photosensitive resin plug, permanently attaching the metal bump of the semiconductor chip to the corresponding metal track of the separate substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.