Inventor · Milpitas, CA, US

Yan Li

14Patents
5h-index
29Co-inventors
58Inventor score

Filing activity: Jun 7, 2016 → Sep 2, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US10249640B2 Within-array through-memory-level via structures and method of making thereof Electricity 34 Active
US10256248B2 Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof Electricity 29 Active
US11133325B2 Memory cell structure of a three-dimensional memory device Electricity 11 Active
US10811058B2 Bonded assembly containing memory die bonded to integrated peripheral and system die and methods for making the same Electricity 10 Active
US10707228B2 Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same Electricity 7 Active
US10644015B2 Memory cell structure of a three-dimensional memory device Electricity 3 Active
US10121522B1 Sense circuit with two sense nodes for cascade sensing Physics 3 Active
US10120816B2 Bad column management with data shuffle in pipeline Physics 2 Active
US10847528B2 Memory cell structure of a three-dimensional memory device Electricity 1 Active
US12063780B2 Memory cell structure of a three-dimensional memory device Electricity 0 Active
US11114439B2 Multi-division 3D NAND memory device Electricity 0 Active
US10790285B2 Multi-division 3D NAND memory device Electricity 0 Active
US10971199B2 Microcontroller for non-volatile memory with combinational logic Physics 0 Active
US10825826B2 Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.