Yue Li
12Patents
3h-index
19Co-inventors
53Inventor score
Filing activity: Dec 14, 2007 → Apr 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9263186B2 | DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor | Electricity | 34 | Active |
| US10321575B2 | Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components | Electricity | 5 | Active |
| US8012874B2 | Semiconductor chip substrate with multi-capacitor footprint | Emerging Cross-Sectional Technologies | 3 | Active |
| US9041176B2 | Hybrid semiconductor module structure | Emerging Cross-Sectional Technologies | 1 | Active |
| US10231324B2 | Staggered power structure in a power distribution network (PDN) | Electricity | 1 | Active |
| US12381326B2 | Multifunctional antenna structure | Electricity | 0 | Active |
| US10170232B2 | Toroid inductor with reduced electromagnetic field leakage | Electricity | 0 | Active |
| US11817406B2 | Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methods | Electricity | 0 | Active |
| US11676922B2 | Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer | Electricity | 0 | Active |
| US11380613B2 | Repurposed seed layer for high frequency noise control and electrostatic discharge connection | Electricity | 0 | Active |
| US12062648B2 | Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods | Electricity | 0 | Active |
| US9998085B2 | Waveguide | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.