Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage

US10199283B1 · kind B1 · utility

Assignee

• PDF SOLUTIONS, INC. · US

Inventors

• Stephen Lam · Merced, US
• Dennis Ciplickas · San Jose, US
• Tomasz Brozek · معلمی نژاد, US
• Jeremy Cheng · San Jose, US
• Simone Comensoli · Gandino, IT
• Indranil De · Alameda, US
• Kelvin Doong · Hsinchu, TW
• Hans Eisenmann · Tutzing, DE
• Timothy Fiscus · Beaver, US
• Jonathan Haigh · Pittsburgh, US
• Christopher Hess · Belmont, US
• John Kibarian · Los Altos Hills, US
• Sherry Lee · San Jose, US
• Marci Liao · Santa Clara, US
• Sheng-Che Lin · Hsinchu, TW
• Hideki Matsuhashi · Santa Clara, US
• Kimon Michaels · Monte Sereno, US
• Conor O'Sullivan · Campbell, US
• Markus Rauscher · Munich, DE
• Vyacheslav Rovner · Pittsburgh, US
• Andrzej Strojwas · Pittsburgh, US
• Marcin Strojwas · Pittsburgh, US
• Carl Taylor · Pittsburgh, US
• Rakesh Vallishayee · Dublin, US
• Larg Weiland · Hollister, US
• Nobuharu Yokoyama · Tokyo, JP

Key dates

• Filing date: Dec 29, 2017
• Grant date: Feb 5, 2019
• Expiry date: Dec 29, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/988
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three electrically connected, parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage.