Multi-purpose non-linear semiconductor package assembly line

US10566309B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thorsten Meyer · Regensburg, DE
• Gerald Ofner · Regensburg, DE
• Peter Scherl · Regensburg, DE
• Stephan Bradl · Regensburg, DE
• Stefan Miethaner · Regensburg, DE
• Alexander Heinrich · Bad Abbach, DE
• Horst Theuss · Wenzenbach, DE

Key dates

• Filing date: Oct 4, 2016
• Grant date: Feb 18, 2020
• Expiry date: Oct 4, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of producing packaged semiconductor devices includes providing a first packaging substrate panel. A second packaging substrate panel is provided. The first and second packaging substrate panels are moved through an assembly line that includes a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The second type packaged semiconductor device is different than the first type packaged semiconductor device. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner.