Patent · US Active

Composition for post chemical-mechanical-polishing cleaning

US10844325B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignee

BASF SE

Inventors

Christian Daeschlein · Bochum, DE
Max Siebert · Ludwigshafen, DE
Michael Lauter · Mannheim, DE
Peter Przybylski · Ludwigshafen, DE
Julian Proelss · Allschwil, CH
Andreas Klipp · Lambsheim, DE
Haci Osman GUEVENC · Heidelberg, DE
Leonardus Leunissen · Ludwigshafen, DE
Roelf-Peter Baumann · Mannheim, DE
Te Yu Wei · Taoyuan, TW

Key dates

Filing date	Dec 20, 2016
Grant date	Nov 24, 2020
Priority date	—
Expiry date	Jan 4, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC11D2111/22
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

A post chemical-mechanical-polishing (post-CMP) cleaning composition including:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.