Methods and apparatus for cleaning substrates
US11103898B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2016 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Nov 23, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2203/007
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.