Patent · US Active

Multi-purpose non-linear semiconductor package assembly line

US11302668B2 · kind B2 · utility

0Cited by

4References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Gerald Ofner · Regensburg, DE
Stephan Bradl · Regensburg, DE
Stefan Miethaner · Regensburg, DE
Alexander Heinrich · Bad Abbach, DE
Horst Theuss · Wenzenbach, DE
Peter Scherl · Regensburg, DE

Key dates

Filing date	Dec 19, 2019
Grant date	Apr 12, 2022
Priority date	—
Expiry date	Dec 19, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of producing packaged semiconductor devices includes providing a first packaging substrate panel, providing a second packaging substrate panel, and moving the first and second packaging substrate panels through an assembly line that comprises a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner. The first and second packaged semiconductor devices differ with respect to at least one of: lead configuration, and encapsulant configuration.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.