Methods and apparatus for cleaning substrates

US11638937B2 · kind B2 · utility

Assignee

• ACM RESEARCH, INC. · US

Inventors

• Hui Wang · Shanghai, CN
• Xi Wang · Shanghai, CN
• Fuping Chen · Shanghai, CN
• Fufa Chen · Cupertino, US
• Jian Wang · Rosharon, US
• Xiaoyan Zhang · Shanghai, CN
• Yinuo Jin · Shanghai, CN
• Zhaowei Jia · Shanghai, CN
• Jun Wang · Nanhu, CN
• Xuejun Li · Shanghai, CN

Key dates

• Filing date: Jul 16, 2021
• Grant date: May 2, 2023
• Expiry date: Jul 16, 2041

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B08B2203/007
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.