Patent · US Active

Flat lead package formation method

US11652084B2 · kind B2 · utility

0Cited by

5References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Gerald Ofner · Regensburg, DE
Stephan Bradl · Regensburg, DE
Stefan Miethaner · Regensburg, DE
Alexander Heinrich · Bad Abbach, DE
Horst Theuss · Wenzenbach, DE
Peter Scherl · Regensburg, DE

Key dates

Filing date	Oct 23, 2020
Grant date	May 16, 2023
Priority date	—
Expiry date	Feb 13, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.