Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
US5904776A · kind A · utility
25Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1997 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Sep 8, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49885
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a two basic structures (including multiple variations within one of the basic structures) and methods for fabrication of the structures which facilitate the flow of cooling gas or other heat transfer fluid to the surface of an electrostatic chuck. The basic structures address both the problem of breakdown of a heat transfer gas in an RF plasma environment and the problem of arcing between a semiconductor substrate and the conductive pedestal portion of the electrostatic chuck in such an RF plasma environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.