Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes
US6261955A · kind A · utility
3Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2000 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Jul 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An effective copper decontamination method in the fabrication of integrated circuits is achieved. An organic-based HFACAC decontamination compound in vapor phase is sprayed over elemental copper found on equipment or tools or as a spill wherein the compound reacts with all of the elemental copper and forms a volatile compound that can be flushed away thereby completing copper decontamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.