Device interconnection

US6870263B1 · kind B1 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Lawrence A. Clevenger · Saratoga Springs, US
• Ronald G. Filippi · Wappingers Falls, US
• Mark Hoinkis · Fishkill, US
• Jeffery L. Hurd · Plattekill, US
• Roy Iggulden · Newburgh, US
• Herbert Palm · Hohenkirchen, DE
• Hans W. Poetzlberger · Munich, DE
• Kenneth P. Rodbell · Sandy Hook, US
• Florian Schnabel · Ehrenkirchen, DE
• Stefan Weber · Fishkill, US
• Ebrahim A. Mehter · Wappingers Falls, US

Key dates

• Filing date: Mar 31, 1998
• Grant date: Mar 22, 2005
• Expiry date: Mar 31, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A conductor for interconnecting integrated circuit components having improved reliability. The conductor includes a liner surrounding at least three surfaces of the conductor, producing a low textured conductor. It has been found that low textured conductor results in improved electromigration lifetime.