Back end interconnect with a shaped interface

US7122462B2 · kind B2 · utility

Assignees

• International Business Machines Corporation · US
• Infineon Technologies AG · DE

Inventors

• Lawrence A. Clevenger · Saratoga Springs, US
• Andrew P. Cowley · Wappingers Falls, US
• Timothy J. Dalton · Ridgefield, US
• Mark Hoinkis · Fishkill, US
• Steffen K. Kaldor · Fishkill, US
• Erdem Kaltalioglu · Newburgh, US
• Kaushik A. Kumar · Heverlee, BE
• Douglas C. La Tulipe, Jr. · Albany, US
• Jochen Schacht · Hsinchu, TW
• Andrew H. Simon · Fishkill, US
• Terry A. Spooner · Clifton Park, US
• Yun-Yu Wang · Poughquag, US
• Clement Wann · Carmel, US
• Chih-Chao Yang · Glenmont, US

Key dates

• Filing date: Nov 21, 2003
• Grant date: Oct 17, 2006
• Expiry date: Feb 4, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An interconnect structure in the back end of the line of an integrated circuit forms contacts between successive layers by removing material in the top surface of the lower interconnect in a cone-shaped aperture, the removal process extending through the liner of the upper aperture, and depositing a second liner extending down into the cone-shaped aperture, thereby increasing the mechanical strength of the contact, which then enhance the overall reliability of the integrated circuit.