Temperature control in a chemical mechanical polishing system
US7153188B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2005 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Oct 7, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/015
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and includes an external surface that contacts a backside of the substrate during polishing. The substrate backing structure also includes a resistive heating system to distribute heat over an area of the external surface and at least one thermally conductive membrane. The external surface is a first surface of the at least one thermally conductive membrane, and the resistive heating system is integrated within one of the at least one thermally conductive membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.