Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7189954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Mar 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01078
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.