Microelectronic imagers and methods of packaging microelectronic imagers
US7199439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Jun 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.