Electronic component and semiconductor wafer, and method for producing the same

US7420262B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Bauer · Nittendorf, DE
• Peter Strobel · Regensburg, DE
• Gerald Ofner · Regensburg, DE
• Edward Fürgut · Dasing, DE
• Simon Jerebic · Regensburg, DE
• Thomas Bemmerl · Schwandorf, DE
• Markus Fink · Monsheim, DE
• Hermann Vilsmeier · Regensburg, DE

Key dates

• Filing date: Feb 27, 2004
• Grant date: Sep 2, 2008
• Expiry date: Feb 27, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.