Vibration damping during chemical mechanical polishing

US7497767B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Hung Chih Chen · San Jose, US
• Shijian Li · San Jose, US
• John M. White · Hayward, US
• Ramin Emami · San Jose, US
• Fred C. Redeker · Fremont, US
• Steven M. Zuniga · Soquel, US
• Ramakrishna Cheboli · Sunnyvale, US

Key dates

• Filing date: Jan 28, 2005
• Grant date: Mar 3, 2009
• Expiry date: Jun 28, 2025

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/30
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A carrier head for chemical mechanical polishing is described. The carrier head includes a backing assembly, a housing and a damping material. The backing assembly includes a substrate support surface. The housing is connectable to a drive shaft to rotate with the drive shaft about a rotation axis. In one implementation, the damping material is in a load path between the backing assembly and the housing to reduce transmission of vibrations from the backing assembly to the housing.