Fluid handling system for wafer electroless plating and associated methods

US8844461B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• William Thie · Mountain View, US
• John M. Boyd · Atascadero, US
• Fritz Redeker · Fremont, US
• Yezdi Dordi · Palo Alto, US
• John Parks · Hercules, US
• Tiruchirapalli Arunagiri · Fremont, US
• Aleksander Owczarz · San Jose, US
• Todd Balisky · Corona, US
• Clint Thomas · Rhome, US
• Jacob Wylie · Fremont, US
• Alan M. Schoepp · Quincy, US

Key dates

• Filing date: Apr 16, 2007
• Grant date: Sep 30, 2014
• Expiry date: Jul 26, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T137/87652
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.