Multi-platen multi-head polishing architecture

US9227293B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jeffrey Drue David · San Jose, US
• Boguslaw A. Swedek · Cupertino, US
• Doyle E. Bennett · Santa Clara, US
• Thomas H. Osterheld · Mountain View, US
• Benjamin Cherian · San Jose, US
• Dominic J. Benvegnu · La Honda, US
• Harry Q. Lee · Los Altos, US
• Allen L. D'Ambra · Burlingame, US
• Jagan Rangarajan · San Jose, US

Key dates

• Filing date: Mar 8, 2013
• Grant date: Jan 5, 2016
• Expiry date: Jul 9, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/345
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.