Method and apparatus for wafer electroless plating

US9287110B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• William Thie · Mountain View, US
• John M. Boyd · Atascadero, US
• Fritz Redeker · Fremont, US
• Yezdi Dordi · Palo Alto, US
• John Parks · Hercules, US
• Tiruchirapalli Arunagiri · Fremont, US
• Aleksander Owczarz · San Jose, US
• Todd Balisky · Corona, US
• Clint Thomas · Rhome, US
• Jacob Wylie · Fremont, US
• Alan M. Schoepp · Quincy, US

Key dates

• Filing date: Jun 14, 2013
• Grant date: Mar 15, 2016
• Expiry date: Sep 30, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6715
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.