Apparatus and methods for reducing particles in semiconductor process chambers

US9761416B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Andrew Nguyen · San Jose, US
• Bradley J. Howard · Boise, US
• Shahid Rauf · Pleasanton, US
• Ajit Balakrishna · Sunnyvale, US
• Tom K. Cho · Palo Alto, US
• Kenneth S. Collins · San Jose, US
• Anand KUMAR · Bengaluru, IN
• Michael D. Willwerth · Campbell, US
• Yogananda Sarode Vishwanath · Bengaluru, IN

Key dates

• Filing date: Mar 7, 2014
• Grant date: Sep 12, 2017
• Expiry date: Nov 28, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/13
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.