CMP pad construction with composite material properties using additive manufacturing processes

US9873180B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Rajeev Bajaj · Fremont, US
• Kasiraman Krishnan · Clifton Park, US
• Mahendra C. ORILALL · Downingtown, US
• Daniel Redfield · معلمی نژاد, US
• Fred C. Redeker · Fremont, US
• Nag B. Patibandla · Pleasanton, US
• Gregory E. Menk · Pleasanton, US
• Jason Garcheung Fung · Sunnyvale, US
• Russell Edward Perry · Pleasanton, US
• Robert E. Davenport · Inver Grove Heights, US

Key dates

• Filing date: Apr 24, 2015
• Grant date: Jan 23, 2018
• Expiry date: Jan 25, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B33Y80/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.