Falk Graetsch
9Patents
5h-index
13Co-inventors
56Inventor score
Filing activity: Apr 19, 2002 → Jul 22, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6723663B1 | Technique for forming an oxide/nitride layer stack by controlling the nitrogen ion concentration in a nitridation plasma | Electricity | 16 | Expired |
| US8445344B2 | Uniform high-k metal gate stacks by adjusting threshold voltage for sophisticated transistors by diffusing a metal species prior to gate patterning | Electricity | 15 | Active |
| US7897450B2 | Method for encapsulating a high-K gate stack by forming a liner at two different process temperatures | Electricity | 7 | Active |
| US6812159B2 | Method of forming a low leakage dielectric layer providing an increased capacitive coupling | Electricity | 6 | Expired |
| US8283232B2 | Enhanced etch stop capability during patterning of silicon nitride including layer stacks by providing a chemically formed oxide layer during semiconductor processing | Electricity | 6 | Active |
| US6875676B2 | Methods for producing a highly doped electrode for a field effect transistor | Electricity | 4 | Expired |
| US6703278B2 | Method of forming layers of oxide on a surface of a substrate | Electricity | 3 | Expired |
| US8951901B2 | Superior integrity of a high-K gate stack by forming a controlled undercut on the basis of a wet chemistry | Electricity | 1 | Active |
| US6900111B2 | Method of forming a thin oxide layer having improved reliability on a semiconductor surface | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.