Inventor · Dresden, DE

Falk Graetsch

9Patents
5h-index
13Co-inventors
56Inventor score

Filing activity: Apr 19, 2002 → Jul 22, 2011

Most-cited inventions

PatentTitleAreaCited byStatus
US6723663B1 Technique for forming an oxide/nitride layer stack by controlling the nitrogen ion concentration in a nitridation plasma Electricity 16 Expired
US8445344B2 Uniform high-k metal gate stacks by adjusting threshold voltage for sophisticated transistors by diffusing a metal species prior to gate patterning Electricity 15 Active
US7897450B2 Method for encapsulating a high-K gate stack by forming a liner at two different process temperatures Electricity 7 Active
US6812159B2 Method of forming a low leakage dielectric layer providing an increased capacitive coupling Electricity 6 Expired
US8283232B2 Enhanced etch stop capability during patterning of silicon nitride including layer stacks by providing a chemically formed oxide layer during semiconductor processing Electricity 6 Active
US6875676B2 Methods for producing a highly doped electrode for a field effect transistor Electricity 4 Expired
US6703278B2 Method of forming layers of oxide on a surface of a substrate Electricity 3 Expired
US8951901B2 Superior integrity of a high-K gate stack by forming a controlled undercut on the basis of a wet chemistry Electricity 1 Active
US6900111B2 Method of forming a thin oxide layer having improved reliability on a semiconductor surface Emerging Cross-Sectional Technologies 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.