Gerd Pfeiffer
26Patents
5h-index
61Co-inventors
72Inventor score
Filing activity: Feb 11, 1982 → Nov 18, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5048871A | Screwed pipe joint | Emerging Cross-Sectional Technologies | 71 | Expired |
| US4659650A | Production of a lift-off mask and its application | Physics | 28 | Expired |
| US7883990B2 | High resistivity SOI base wafer using thermally annealed substrate | Emerging Cross-Sectional Technologies | 16 | Active |
| US4955644A | Drill pipe coupling | Fixed Constructions | 10 | Expired |
| US4445354A | Procedure and equipment for the manufacture of pipes with external and internal diameters varying in stages | Performing Operations; Transporting | 8 | Expired |
| US8614115B2 | Photovoltaic solar cell device manufacture | Emerging Cross-Sectional Technologies | 3 | Active |
| US8735212B2 | Silicon solar cell manufacture | Emerging Cross-Sectional Technologies | 2 | Active |
| US8665575B2 | Solar module with overheat protection | Emerging Cross-Sectional Technologies | 2 | Active |
| US8951896B2 | High linearity SOI wafer for low-distortion circuit applications | Electricity | 2 | Active |
| US8536035B2 | Silicon-on-insulator substrate and method of forming | Electricity | 2 | Active |
| US8298908B2 | Structure and method for forming isolation and buried plate for trench capacitor | Electricity | 1 | Active |
| US8535970B2 | Manufacturing process for making photovoltaic solar cells | Emerging Cross-Sectional Technologies | 1 | Active |
| US9252133B2 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Electricity | 1 | Active |
| US8907494B2 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Electricity | 1 | Active |
| US10319870B2 | Photovoltaic module with a controllable infrared protection layer | Emerging Cross-Sectional Technologies | 1 | Active |
| US8197912B2 | Precision separation of PV thin film stacks | Emerging Cross-Sectional Technologies | 1 | Active |
| US8637958B2 | Structure and method for forming isolation and buried plate for trench capacitor | Electricity | 1 | Active |
| US6531411B1 | Surface roughness improvement of SIMOX substrates by controlling orientation of angle of starting material | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9165819B2 | High linearity SOI wafer for low-distortion circuit applications | Electricity | 1 | Active |
| US4404832A | Operating a rolling mill working on seamless tubing | Performing Operations; Transporting | 1 | Expired |
| US8679863B2 | Fine tuning highly resistive substrate resistivity and structures thereof | Electricity | 0 | Active |
| US9246028B2 | Silicon solar cell manufacture | Emerging Cross-Sectional Technologies | 0 | Active |
| US8486751B2 | Method of manufacturing a photovoltaic cell | Emerging Cross-Sectional Technologies | 0 | Active |
| US8372725B2 | Structures and methods of forming pre fabricated deep trench capacitors for SOI substrates | Electricity | 0 | Active |
| US9634165B2 | Regeneration method for restoring photovoltaic cell efficiency | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.