Huma Ashraf
11Patents
3h-index
17Co-inventors
57Inventor score
Filing activity: Aug 1, 1997 → Nov 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6051503A | Method of surface treatment of semiconductor substrates | Electricity | 211 | Expired |
| US6187685A | Method and apparatus for etching a substrate | Electricity | 135 | Expired |
| US6261962A | Method of surface treatment of semiconductor substrates | Electricity | 44 | Expired |
| US9601341B2 | Method of etching | Electricity | 1 | Active |
| US10431436B2 | Method and system of monitoring and controlling deformation of a wafer substrate | Electricity | 0 | Active |
| US11037793B2 | Method of plasma etching | Electricity | 0 | Active |
| US9040427B2 | Method of plasma etching | Electricity | 0 | Active |
| US11664232B2 | Method and apparatus for plasma etching | Electricity | 0 | Active |
| US10899606B2 | Microneedles | Performing Operations; Transporting | 0 | Active |
| US11489106B2 | Method of plasma etching | Electricity | 0 | Active |
| US11056379B2 | Clamp assembly | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.