Inventor · Boise, ID, US

Jiewei Chen

13Patents
1h-index
35Co-inventors
46Inventor score

Filing activity: Jul 12, 2016 → Aug 24, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US11049768B2 Methods of forming microelectronic devices, and related microelectronic devices, and electronic systems Electricity 3 Active
US12322443B2 Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells Electricity 0 Active
US11600630B2 Integrated assemblies and methods of forming integrated assemblies Electricity 0 Active
US12272421B2 Creating dynamic latches above a three-dimensional non-volatile memory array Physics 0 Active
US9868114B2 Preparation method of fluorine-doped lamellar black titanium dioxide nano material Emerging Cross-Sectional Technologies 0 Active
US12167579B2 Device temperature adjustment Electricity 0 Active
US11688689B2 Electronic devices including stair step structures, and related memory devices, systems, and methods Electricity 0 Active
US12250812B2 Integrated assemblies and methods of forming integrated assemblies Electricity 0 Active
US12406728B2 Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems Electricity 0 Active
US12406731B2 Dynamic latches above a three-dimensional non-volatile memory array Physics 0 Active
US11895834B2 Methods used in forming a memory array comprising strings of memory cells Electricity 0 Active
US12406932B2 Memory circuitry and method used in forming memory circuitry Electricity 0 Active
US12295140B2 Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.