Inventor · Dresden, DE

Jorg Radecker

7Patents
3h-index
17Co-inventors
50Inventor score

Filing activity: Aug 27, 2002 → Apr 12, 2012

Most-cited inventions

PatentTitleAreaCited byStatus
US6908831B2 Method for fabricating a semiconductor structure with an encapsulation of a filling which is used for filling trenches Electricity 5 Expired
US7718475B2 Method for manufacturing an integrated circuit including a transistor Electricity 3 Active
US8415214B2 STI silicon nitride cap for flat FEOL topology Electricity 3 Active
US8642419B2 Methods of forming isolation structures for semiconductor devices Electricity 2 Active
US7125778B2 Method for fabricating a self-aligning mask Electricity 0 Expired
US8853051B2 Methods of recessing an active region and STI structures in a common etch process Electricity 0 Active
US8679940B2 Methods for fabricating semiconductor devices with isolation regions having uniform stepheights Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.