Mike Violette
46Patents
12h-index
21Co-inventors
81Inventor score
Filing activity: Jan 23, 1996 → Jun 2, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6376284B1 | Method of fabricating a memory device | Electricity | 215 | Expired |
| US6653733B1 | Conductors in semiconductor devices | Electricity | 61 | Expired |
| US6369431B1 | Method for forming conductors in semiconductor devices | Electricity | 50 | Expired |
| US7800092B2 | Phase change memory elements using energy conversion layers, memory arrays and systems including same, and methods of making and using | Emerging Cross-Sectional Technologies | 33 | Active |
| US6700211B2 | Method for forming conductors in semiconductor devices | Electricity | 32 | Expired |
| US6670713B2 | Method for forming conductors in semiconductor devices | Electricity | 23 | Expired |
| US7859893B2 | Phase change memory structure with multiple resistance states and methods of programming and sensing same | Emerging Cross-Sectional Technologies | 16 | Active |
| US7952919B2 | Phase change memory structure with multiple resistance states and methods of programming and sensing same | Emerging Cross-Sectional Technologies | 15 | Active |
| US7684227B2 | Resistive memory architectures with multiple memory cells per access device | Physics | 14 | Active |
| US6812529B2 | Suppression of cross diffusion and gate depletion | Electricity | 14 | Expired |
| US7397689B2 | Resistive memory device | Physics | 13 | Active |
| US7745231B2 | Resistive memory cell fabrication methods and devices | Electricity | 12 | Active |
| US6893957B2 | Method of forming a dual damascene interconnect by selective metal deposition | Electricity | 12 | Expired |
| US6723597B2 | Method of using high-k dielectric materials to reduce soft errors in SRAM memory cells, and a device comprising same | Electricity | 11 | Expired |
| US6534866B1 | Dual damascene interconnect | Electricity | 10 | Expired |
| US6563220B2 | Method for forming conductors in semiconductor devices | Electricity | 10 | Expired |
| US6127236A | Method of forming a lateral bipolar transistor | Electricity | 8 | Expired |
| US6489665B2 | Lateral bipolar transistor | Electricity | 7 | Expired |
| US6594172B2 | Method of selectively forming local interconnects using design rules | Electricity | 6 | Expired |
| US5945726A | Lateral bipolar transistor | Electricity | 5 | Expired |
| US6962841B2 | Suppression of cross diffusion and gate depletion | Electricity | 5 | Expired |
| US6724089B2 | Dual damascene interconnect | Electricity | 5 | Expired |
| US6535413B1 | Method of selectively forming local interconnects using design rules | Electricity | 5 | Expired |
| US6090685A | Method of forming a LOCOS trench isolation structure | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6900494B2 | Method of using high-k dielectric materials to reduce soft errors in SRAM memory cells, and a device comprising same | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.