Peter Moldauer
11Patents
5h-index
9Co-inventors
51Inventor score
Filing activity: May 13, 2002 → Jun 5, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6769102B2 | Verifying proximity of ground metal to signal traces in an integrated circuit | Physics | 32 | Expired |
| US7075185B2 | Routing vias in a substrate from bypass capacitor pads | Electricity | 10 | Expired |
| US7078812B2 | Routing differential signal lines in a substrate | Electricity | 8 | Expired |
| US6922822B2 | Verifying proximity of ground vias to signal vias in an integrated circuit | Physics | 8 | Expired |
| US6711730B2 | Synthesizing signal net information from multiple integrated circuit package models | Physics | 8 | Expired |
| US6807657B2 | Inter-signal proximity verification in an integrated circuit | Physics | 5 | Expired |
| US7327583B2 | Routing power and ground vias in a substrate | Electricity | 2 | Expired |
| US6788135B1 | Terminating pathway for a clock signal | Electricity | 1 | Expired |
| US7326860B2 | Routing vias in a substrate from bypass capacitor pads | Electricity | 0 | Active |
| US6861912B1 | Oscillator method and apparatus for a test chip | Electricity | 0 | Expired |
| US7203043B2 | Method and structure for external control of ESD protection in electronic circuits | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.