Robert Gruenberger
9Patents
1h-index
12Co-inventors
44Inventor score
Filing activity: Jun 4, 2008 → Oct 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7889030B2 | Passive temperature compensation of silicon MEMS devices | Electricity | 12 | Active |
| US8125046B2 | Micro-electromechanical system devices | Performing Operations; Transporting | 1 | Active |
| US10899604B2 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Performing Operations; Transporting | 1 | Active |
| US11505450B2 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Performing Operations; Transporting | 0 | Active |
| US8993394B2 | Micro-electromechanical system devices | Performing Operations; Transporting | 0 | Active |
| US11247895B2 | Segmented stress decoupling via frontside trenching | Performing Operations; Transporting | 0 | Active |
| US10807862B1 | Segmented stress decoupling via frontside trenching | Performing Operations; Transporting | 0 | Active |
| US10843916B2 | Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-filling | Performing Operations; Transporting | 0 | Active |
| US8318581B2 | Micro-electromechanical system devices | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.