Terry Alcorn
12Patents
4h-index
16Co-inventors
53Inventor score
Filing activity: Mar 15, 2013 → Mar 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9847411B2 | Recessed field plate transistor structures | Electricity | 16 | Active |
| US10971612B2 | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability | Electricity | 12 | Active |
| US8970010B2 | Wafer-level die attach metallization | Electricity | 5 | Active |
| US9679981B2 | Cascode structures for GaN HEMTs | Electricity | 5 | Active |
| US11658234B2 | Field effect transistor with enhanced reliability | Electricity | 1 | Active |
| US9536783B2 | Wafer-level die attach metallization | Electricity | 1 | Active |
| US11842997B2 | Methods for pillar connection on frontside and passive device integration on backside of die | Electricity | 0 | Active |
| US11769768B2 | Methods for pillar connection on frontside and passive device integration on backside of die | Electricity | 0 | Active |
| US11075271B2 | Stepped field plates with proximity to conduction channel and related fabrication methods | Electricity | 0 | Active |
| US11616136B2 | High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability | Electricity | 0 | Active |
| US11646310B2 | Methods for pillar connection on frontside and passive device integration on backside of die | General | 0 | Revoked |
| US11502178B2 | Field effect transistor with at least partially recessed field plate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.