Upinder Singh
8Patents
2h-index
13Co-inventors
44Inventor score
Filing activity: Apr 10, 2015 → Apr 11, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9806032B1 | Integrated circuit structure with refractory metal alignment marker and methods of forming same | Electricity | 4 | Active |
| US9406764B2 | Simple and cost-free MTP structure | Electricity | 4 | Active |
| US10797159B2 | Poly finger fabrication for HCI degradation improvement of ultra-low-Ron EDNMOS | Electricity | 0 | Active |
| US11791392B2 | Extended-drain metal-oxide-semiconductor devices with a notched gate electrode | Electricity | 0 | Active |
| US10319834B2 | Poly finger fabrication for HCI degradation improvement of ultra-low-Ron EDNMOS | Electricity | 0 | Active |
| US12336220B2 | Extended-drain metal-oxide-semiconductor devices with a gap between the drain and body wells | Electricity | 0 | Active |
| US12176395B1 | Structures for a laterally-diffused metal-oxide-semiconductor transistor | Electricity | 0 | Active |
| US11502193B2 | Extended-drain metal-oxide-semiconductor devices with a multiple-thickness buffer dielectric layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.