Inventor · Singapore, SG

Wuping Liu

16Patents

3h-index

33Co-inventors

56Inventor score

Filing activity: Dec 23, 2002 → Jul 29, 2014

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8358007B2	Integrated circuit system employing low-k dielectrics and method of manufacture thereof	Electricity	12	Active
US7601607B2	Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects	Electricity	7	Active
US9443761B2	Methods for fabricating integrated circuits having device contacts	Electricity	4	Active
US7012022B2	Self-patterning of photo-active dielectric materials for interconnect isolation	Electricity	3	Expired
US7276440B2	Method of fabrication of a die oxide ring	Electricity	2	Expired
US6995087B2	Integrated circuit with simultaneous fabrication of dual damascene via and trench	Electricity	2	Expired
US7153766B2	Metal barrier cap fabrication by polymer lift-off	Electricity	2	Expired
US9449834B2	Method of fabricating semiconductor devices including PMOS devices having embedded SiGe	Electricity	2	Active
US6967156B2	Method to fabricate aligned dual damascene openings	Electricity	1	Expired
US7323408B2	Metal barrier cap fabrication by polymer lift-off	Electricity	0	Expired
US7906426B2	Method of controlled low-k via etch for Cu interconnections	Electricity	0	Active
US7678586B2	Structure and method to prevent charge damage from e-beam curing process	Electricity	0	Active
US7256136B2	Self-patterning of photo-active dielectric materials for interconnect isolation	Electricity	0	Expired
US8018061B2	Integrated circuit hard mask processing system	Electricity	0	Active
US7615484B2	Integrated circuit manufacturing method using hard mask	Electricity	0	Active
US7372156B2	Method to fabricate aligned dual damascene openings	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.