IC with test structures and E-beam pads embedded within a contiguous standard cell area
US10978438B1 · kind B1 · utility
4Cited by
161References
14Claims
0Family size
Assignee
Inventors
- Stephen Lam
- Dennis Ciplickas
- Tomasz Brozek
- Jeremy Cheng
- Simone Comensoli
- Indranil De
- Kelvin Doong
- Hans Eisenmann
- Timothy Fiscus
- Jonathan Haigh
- Christopher Hess
- John Kibarian
- Sherry Lee
- Marci Liao
- Sheng-Che Lin
- Hideki Matsuhashi
- Kimon Michaels
- Conor O'Sullivan
- Markus Rauscher
- Vyacheslav Rovner
- Andrzej Strojwas
- Marcin Strojwas
- Carl Taylor
- Rakesh Vallishayee
- Larg Weiland
- Nobuharu Yokoyama
- Matthew Moe
Key dates
| Filing date | Jun 29, 2019 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Jun 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/988
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.